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Invitation for Manuscripts concerning engineering subjects for publication in the IEC International Journal of Technology.

In tune with its innovative leadership in academics, IEC Group of Institutions, Greater Noida is commencing publication of a Technical Journal to provide a forum for publishing new findings on engineering and technology. The journal strives to supplement aims and objectives of this premier college by encouraging thoughtful creative minds that become fulcrum for innovations, development and academic leadership.

IEC International Journal of Technology will have a periodicity of six months and will be distributed among top-level universities and technical institutions worldwide with no charge, so that it may encourage further development in the related fields. All communications in this respect will be free-of-cost. The idea behind this task is to provide platform that encourages innovations in the field of engineering and make exchange of the same among other institutions of repute abroad.

This effort would certainly help the growth of research and its subsequent expeditious progress in the world. Scientific articles are invited from faculty members and scientists related to engineering branches, namely, Electrical Engineering, Electronics, Communication Technology, Instrumentation and Measurement, Information Technology, Computers, Mechanical Engineering, Robotics and allied disciplines. In-depth Review articles providing a global overview of a particular topic are welcome.


Soft copies of the articles generally, limited to 3000 words in .doc format are invited. IEEE style of preparation of the manuscript will be followed. Equations should be composed using 'Equations Editor'. Figure captions should not form part of the figures: they should be composed separately at the bottom of each figure. Tables should be serially-numbered and put together at the end. References should be
compiled and cited as per the IEEE style.

The benefits of publishing articles in the 'IEC International journal' include:

* Fast publication times: your paper will appear online as soon as it is ready, in advance of print version

* Excellent editorial standards

* Access free on-line issue of journal.

* A rigorous, fast and constructive peer review process

* All abstracts and full text available free on-line to all main universities/institutions Worldwide.

* No publication charge unlike some other technical journals.

Contributions may please be e-mailed to: